Reliability is one of the most important factors in circuit design. For modern CMOS technology, the circuit reliability is influenced by the shrinking of technology, the reduced supply voltage, higher frequency, and higher circuit density. These factors affects the circuit's probability of soft errors (also called single event upset). In addition, the process variation introduced in the fabrication process is also a big challenge for circuit designers because it makes the same circuit show different characteristics. Moreover, to reduce power consumption of the circuit, the method of reducing supply voltage to near threshold region is used, which is anticipated to have more effects on the reliability of the circuit. So the relationship between …show more content…
Single event effects can induce destructive and nondestructive damage to the circuit. In this thesis, only the nondestructive single event effect is taken into account. The basic mechanism for the single event effect in microelectronics includes the charge deposition and the charge collection. In the charge deposition process, there are two ways to release charge in semiconductor devices: (1) direct ionization is caused by the incident particles, and (2) indirect ionization is caused by the nuclear reaction between the incident particle and the device. Usually the deposition mechanism for heavy ions like alpha particles is mainly direct ionization, and light particles like protons and neutrons can result in single event upset by indirect ionization \cite{1208578}. For direct ionization, when a particle hits the silicon substrate, a track of electron-hole pairs (EHPs) is generated as the particle travels through the material and loses energy along its path. For indirect ionization, as the light particles enter the semiconductor device, nuclear reactions will occur: (1) elastic collision; (2) the emission of alpha or gamma particles and the recoil of a daughter nucleus; (3) spallation reactions. The products of these reactions can deposit energy along their path by direct ionization
Now the value of the Schottky barrier height is dependent on the contact resistances of the metal and semiconductor under consideration. The idea of a schottky contact is that when metal and semiconductor are brought into contact with eac...
...hborhood, additive CA are ideally suited for V LSI implementation. Different applications ranging from V LSI test domains to the design of a hardwired version of different CA based schemes have been proposed.
Once Shockley returned to Bell Labs in New Jersey, he immediately joined a research group headed by Dr. C. J. Davisson. His group consisted of Bardeen and Brattain. Most of the time, he left them and worked alone. He would drop in on them occasionally to check up on their work. With Shockley’s idea of using field effects and applying the quantum theory to the development of semiconductors, Bardeen and Brattain succeeded in creating a point-contact transistor.
An ion is a “electrically charged atom or groups of atoms”. (works, 2009)Referring to positively and negatively charged atoms that are used to form an ion. A document discusses how in order for an atom to become an negative ion it has to receive/gain electrons. However for a atom to become a positive ion it has to lose electrons. Another name for a negative ion is anion and another name for a positive ion is cation. This is also known as the Ionization process. Ionization in general can take place in an liquid, solid, and/or gases. Ions are also known to form when a dissociation is occurred. When this particular process begins to occur oppositely charged ions begin to dissolve for example in water or another form of solvent. These are known as electrolytes When a These terms are important to know because the experiment deals with an ion space system. Including but not limiting to acids, bases, and salts. These are often a good conductor for electricity which is why they are typically used for these space engines. (works, 2009). It is important to understand the ion and how it is formed and why it reacts because it is used in our experiment. Which would help to better understand what everything is talking about. Especially since the ...
A single point of failure refers to the failure of a component that can terminate
The word scenario appears in the dictionaries with two main meanings. The first, as reported by the Cambridge Dictionary, is “a written plan of the characters and events in a play or film” so it assumes the sense of plan. For instance, in the context of movie, a scenario is, more precisely, the part of the screenwriting process which precedes the screenplay, so it is a synoptical collage of events or series of actions. In this acceptation, scenarios are used in project and product planning to represent hypothetical sequences of happenings constructed to take into account the causal interrelations.
The ubiquity of silicon chips has been primarily driven by the breadth, and rate of innovation in the semiconductor field over the past fifty years. Every realm of human life has benefited from these advancements, and it is gratifying to know that each of us in the field has played a part, however infinitesimal. However, disruptive innovation in the next ten years will surpass all that we have accomplished in the last fifty years.
An alpha particle is a type an ionizing radiation, which emits particles, composed of two protons and two neutrons, without elections; giving it a net positive charge. The radiation is only effective if these alpha particles are e...
an initial energy of about 1 MeV will induce fission is rather low, but can be
Davisson and Germer found that by varying the applied voltage to the electron gun, the maximum intensity of electrons diffracted by the atomic surface was found at different angles. The highest intensity was found to be at an angle θ = 50° with a voltage of 54 V, giving the electrons a kinetic energy of 54 eV.
“After the integrated circuits the only place to go was down—in size that it. Large scale integration (LS) could fit hundreds of components onto one chip. By the 1980’s, very large scale integration (VLSI) squeezed hundreds of thousands of components onto a chip. Ultra-Large scale integration (ULSI) increased that number into millions. The ability to fit so much onto an area about half the size of ...
... failure, only 650 failures recorded, which only covers 7.1% of the whole errors made by the workers or robots in the factory. This means high load level has 7.8 times increased risk or failure rate compare to low load level, and moderate load level obtained 5.3 times.
Typical hardware faults are stuck-at fault, transition fault, coupling fault and many more. These faults degrade the quality of the hardware and yields poor performance. We need to have an approach to test a chip for hardware fault.
Intel's taking care of this inadequate chip scenario offers ascent to numerous inquiries. During the course of this paper I will address some of them.
As technologies scales down process variation effect become more significant. Process variation causes circuit performance deviate from its initial design expectation. Therefore, it may lead to reducing the timing margins and hence, increasing the timing violation probability. As the result by shrinking the size of the transistors the importance of delay test has become more and more [10]. Process variation is a combination of systematic effects and random effects (e.g. the number of dopant atoms implanted in a transistor) which cause variation in frequency [9]. It should be noted that the random type variations especially RDF (Random Dopant Fluctuation) are dominant [14].