History Of Electroless Nickel Plating

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Electroless nickel (EN) plating was discovered by Brenner & Riddell in 1946. (1) EN plating is being large economically accessible under 30 years, is generally youthful compared with other plating. However, it has obtained significant industrial importance, being the most vital catalytic process in use today with a development rate of 5% annually. (2) Electroless nickel plating is a process in which one or more layers of nickel is deposited onto an active substrate by chemical reduction without the utilization of an external power source. (3) The process is termed “electroless” in light of the fact that the electrons are supplied by a chemical reducing agent instead of electrically. (2) Since the metal being applied is in the solution and adheres itself to the substrate without the utilization of an electric current, it is also referred to as an “autocatalytic” process. (3) A base substrate being plated also catalytic in nature or a substrate catalyzed by some form of pretreatment. The specific catalytic surfaces (almost all metals of Group …show more content…

It functions as to provide for a moderate rate of reaction of nickel precipitation and to prevent precipitation of the nickel compound. The complexing agents generally further solubilize the hypophosphite degradation product formed during the plating process and to complex the nickel ions present in the solution. The complexing agents form a more stable nickel complex with nickel ions and slow down directly the precipitation of nickel ions from the plating solution as insoluble salts such as phosphites. Complexing agents may also act as catalyst inhibitors to reduce the potential for spontaneous decomposition of the electroless nickel plating bath. Complexing agents used in electroless nickel plating includes carboxylic acids, polyamine or sulfonic acids or a mixture of them. The complexing agents normally are used at concentration about 20 to about 40 g/L.

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