Decapsulation of die packages, made simple! Mechanical Decapsulation of microelectronic packages with the PetroThin, offers numerous advantages. Metal and ceramic packages that are resistant to chemical attack can easily be prepared Multiple packages can be decapsulated at the same time Decapsulate large packages up to 2”x2” in size Multilayer stacked die are quickly removed The PetroThin allows for a quick, accurate, repeatable way of thinning within +5 microns, before a final chemical etch. A possible addition application would be to remove a chip layer form a stack. If a failure has accorded in a layer other than the top layer then removing these layers will be the objective. Buehler’s ad has appeared in Microscopy Today & Electronic Device Failure Analysis magazines. It discusses using the PetroThin to decapsulate molded electronic packages and assemblies. Since this is a new application for Buehler, I wanted to provide you some information on how it is used. Many failure analysis laboratories will remove the packaging material that covers the electronic circuit. If nondestructive localization techniques are unsuccessful or not precise enough, decapsulation is performed to conduct electrical measurement or verification. The process is used for large and small size packages and assemblies encapsulated with a mixture of a variety of cured epoxies, and molding compounds that are resistant to conventional chemical attack methods. The PetroThin is also ideal for removing these epoxies and metal covered packages or multiple packages at one time. Keep in mind that mechanical decapsulation will only remove material to within 10 to 15 microns of the circuitry. Chemical decapsulatio... ... middle of paper ... ...nnects. The newest version of the X-mill costs ≈90,000 usd well above the PetroThin. Both these mechanical systems wil have to utilize chemical decapsulation system to fully expose the circuit. Nisene Technology Group markets a chemical system called JetEtch and their newest system, the OmniEtch, which also delayers. There are also laser decapsulation systems which are very expensive but they are available. Control Systemation offers a unit called F/A Lit. At this time, I do not have any competitive pricing information on any of these systems. Our lab assisted in the development of this application and can also answer any questions. We have sold PetroThin’s for this application. The customers liked the ease of use and speed in which they can decapsulate multiple packages. For additional technical information, please contact us at info@buehler.com.
The protective packaging industry can be segmented three ways by use: positioning, block, and bracing; flexible wraps; and void fill. Coated (e.g., AirCap) and uncoated air bubble products serve the flexible wrap and void fill markets (refer to Glossary). The flexible wrap market, which dwarfs void fill as measured by annual sales, is of primary concern to Sealed Air and will thus constitute the focus of this report.
Project responsibility is assigned to the division’s Research and Development Group: Mike Richards, the project scientist who developed the product, is assigned responsibiliy for project management. Assistance will be required from other parts of the company: Packaging Task Force, R & D Group: Corporate Engineering: Corporate Purchasing: Hospital Products Manufacturing Group: Packaged Products Manufacturing Group.
The new TT-9CW is capable of far more than high production speeds, it can also run products that are currently unavailable to run on the TT-8CN machines that are operating in your facilities. One of these new options is the “spoutable” preformed pouch. This type of pouch is currently run by a single other comp...
This tool has a thin metal sheet or ribbon attached to the handle. The ribbon carves into the material.
A piece of well-oiled machinery consists of an intricate and complex system: there are well-organized processes, mechanisms within the device work efficiently, and multiple processes function simultaneously to subsequently perform various functions. What happens when there is a glitch in the machine? When there is something wrong, such as connections between intricate processes, which do not follow through, the machine fails to function properly. In some cases, there are not any adjustment or fallback mechanisms. At that point, the damage can be irreversible and the machinery is no longer salvageable. [However, this can illustrate the interactions and processes within the complex machinery.]
It is generally perceived that electronics are not intended for reuse. In the event that it is completed accurately, hardware reusing can anticipate contamination, make occupations, and spare assets as specified by Thomas, Valerie.... ... middle of paper ... ... The Web.
3. Etching: If the resist is placed in a developer solution after selective exposure to a light source, it will etch away one of the two regions (exposed or unexposed). Then another layer of material is deposited and the first layer selectively etched away as shown in the figure resulting in the required MEMS.
As shown in the figure below, the rigid master is prepared by lithography, molding or by some other techniques and then the prepolymer is poured onto the master and cured thus giving us the polymer replica.
· The same diameter corer is used so to keep the surface area of each
Maher (1999) states that the different packages on the market have different strengths in different areas, it is important for the customer to recognise this and select the package with the strengths that are appropriate. Only when top management have reached consensus on what the business requires, should package vetting and selection begin.
Sealing will go on as mentioned earlier and the products which are packed are moved onto to the discharge conveyor consisting of checkweighers, metal detectors and pneumatic
No technology is perfect thus, this literature review also highlight the many limitations of this innovative technology
These packages are relatively easier to use than bespoke due to the fact that they are used previously and good packages are also accompanied by an easy to follow manual or online assistance is readily accessible.
Cheney, Susan. ?Packaging & Manufacturing.? Candy Industry (Jun. 2000): 20. InfoTrac. Online. Nov. 2002 .
Also, micro machining was performed on the substrate to improve the part’s feature resolution (cavities for electrical components and channels for the inks).