Decapsulation of die packages, made simple! Mechanical Decapsulation of microelectronic packages with the PetroThin, offers numerous advantages. Metal and ceramic packages that are resistant to chemical attack can easily be prepared Multiple packages can be decapsulated at the same time Decapsulate large packages up to 2”x2” in size Multilayer stacked die are quickly removed The PetroThin allows for a quick, accurate, repeatable way of thinning within +5 microns, before a final chemical etch. A possible addition application would be to remove a chip layer form a stack. If a failure has accorded in a layer other than the top layer then removing these layers will be the objective. Buehler’s ad has appeared in Microscopy Today & Electronic Device Failure Analysis magazines. It discusses using the PetroThin to decapsulate molded electronic packages and assemblies. Since this is a new application for Buehler, I wanted to provide you some information on how it is used. Many failure analysis laboratories will remove the packaging material that covers the electronic circuit. If nondestructive localization techniques are unsuccessful or not precise enough, decapsulation is performed to conduct electrical measurement or verification. The process is used for large and small size packages and assemblies encapsulated with a mixture of a variety of cured epoxies, and molding compounds that are resistant to conventional chemical attack methods. The PetroThin is also ideal for removing these epoxies and metal covered packages or multiple packages at one time. Keep in mind that mechanical decapsulation will only remove material to within 10 to 15 microns of the circuitry. Chemical decapsulatio... ... middle of paper ... ...nnects. The newest version of the X-mill costs ≈90,000 usd well above the PetroThin. Both these mechanical systems wil have to utilize chemical decapsulation system to fully expose the circuit. Nisene Technology Group markets a chemical system called JetEtch and their newest system, the OmniEtch, which also delayers. There are also laser decapsulation systems which are very expensive but they are available. Control Systemation offers a unit called F/A Lit. At this time, I do not have any competitive pricing information on any of these systems. Our lab assisted in the development of this application and can also answer any questions. We have sold PetroThin’s for this application. The customers liked the ease of use and speed in which they can decapsulate multiple packages. For additional technical information, please contact us at info@buehler.com.
This new form was called hydraulic die-forming. Hydraulic stems from the Greek word hydro meaning water and aulos meaning tube (McCreight, 2004). In today’s society, hydraulic pressing and stamping of dies are used for everything from making small pots and pans to the more extravagant automobile body models. Another use that has recently developed is the more artistic use of, producing form in silver and gold. In order to achieve this smaller, cheaper scale of die-forming experiment were conducted by Richard Thomas and Ruth Girard, which eventually led to the development of the pourable epoxy steel...
The protective packaging industry can be segmented three ways by use: positioning, block, and bracing; flexible wraps; and void fill. Coated (e.g., AirCap) and uncoated air bubble products serve the flexible wrap and void fill markets (refer to Glossary). The flexible wrap market, which dwarfs void fill as measured by annual sales, is of primary concern to Sealed Air and will thus constitute the focus of this report.
The packaging aspect involves gathering the communication materials, combining them into one package, and distribution. The materials can be used by employees to answer some basic questions they may have. If their questions can not be answered, they are encouraged to contact the human resource department (of Capital) or Arbor.
The new TT-9CW is capable of far more than high production speeds, it can also run products that are currently unavailable to run on the TT-8CN machines that are operating in your facilities. One of these new options is the “spoutable” preformed pouch. This type of pouch is currently run by a single other comp...
In hybrid machines, the additive print head is typically treated as an interchangeable CNC tool, which can automatically be swapped out for other milling tools. Because additive manufacturing is much more efficient with materials compared to milling, hybrid systems are intended to produce a part predominantly though the additive process as opposed to milling. Material is first deposited layer-wise by additive manufacturing to obtain a part which is close to its final shape, and then followed by CNC milling to obtain the final part .
A piece of well-oiled machinery consists of an intricate and complex system: there are well-organized processes, mechanisms within the device work efficiently, and multiple processes function simultaneously to subsequently perform various functions. What happens when there is a glitch in the machine? When there is something wrong, such as connections between intricate processes, which do not follow through, the machine fails to function properly. In some cases, there are not any adjustment or fallback mechanisms. At that point, the damage can be irreversible and the machinery is no longer salvageable. [However, this can illustrate the interactions and processes within the complex machinery.]
A single point of failure refers to the failure of a component that can terminate
Maher (1999) states that the different packages on the market have different strengths in different areas, it is important for the customer to recognise this and select the package with the strengths that are appropriate. Only when top management have reached consensus on what the business requires, should package vetting and selection begin.
Plastics Engineering manufacturing and handbook (Volume 2) (Dominik V Rosato, Donald V Rosato, Nick R Schott) PAGE: 1300-1303
Exothermal energy of polymer cure (as in epoxy adhesives), allows determination of the degree and rate of cure.
Project responsibility is assigned to the division’s Research and Development Group: Mike Richards, the project scientist who developed the product, is assigned responsibiliy for project management. Assistance will be required from other parts of the company: Packaging Task Force, R & D Group: Corporate Engineering: Corporate Purchasing: Hospital Products Manufacturing Group: Packaged Products Manufacturing Group.
By postponing the decoupling point, the risk of being out of stock and the risk of holding too much stock of products which are not required is significant lower (Ben Naylor, Naim and Berry, 1999). And the flexibility of product type is notably increased. While on the other hand, the lead time will be significantly longer, and the economics of scale in the packaging process is reduced. By making the trade-off between the pros and cons, setting up MDP upstream of the packaging process is the best
Moreover in general, the biomaterials can be further categorized into: polymers, metals, ceramics, and composites.
Hence this system allows to design control systems with a high safety level as well as a big increase in maintainability. Any failure can be detected by the control system and the installation will be always in a safe state. When the system allows to identify its own failures, the corrective maintenance tasks are simplified, so the maintainability and the plant availability increase.
3. Etching: If the resist is placed in a developer solution after selective exposure to a light source, it will etch away one of the two regions (exposed or unexposed). Then another layer of material is deposited and the first layer selectively etched away as shown in the figure resulting in the required MEMS.