Mechanical Decapsulation of Microelectronic Packages with the PetroThin

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Decapsulation of die packages, made simple! Mechanical Decapsulation of microelectronic packages with the PetroThin, offers numerous advantages.  Metal and ceramic packages that are resistant to chemical attack can easily be prepared  Multiple packages can be decapsulated at the same time  Decapsulate large packages up to 2”x2” in size  Multilayer stacked die are quickly removed The PetroThin allows for a quick, accurate, repeatable way of thinning within +5 microns, before a final chemical etch. A possible addition application would be to remove a chip layer form a stack. If a failure has accorded in a layer other than the top layer then removing these layers will be the objective. Buehler’s ad has appeared in Microscopy Today & Electronic Device Failure Analysis magazines. It discusses using the PetroThin to decapsulate molded electronic packages and assemblies. Since this is a new application for Buehler, I wanted to provide you some information on how it is used. Many failure analysis laboratories will remove the packaging material that covers the electronic circuit. If nondestructive localization techniques are unsuccessful or not precise enough, decapsulation is performed to conduct electrical measurement or verification. The process is used for large and small size packages and assemblies encapsulated with a mixture of a variety of cured epoxies, and molding compounds that are resistant to conventional chemical attack methods. The PetroThin is also ideal for removing these epoxies and metal covered packages or multiple packages at one time. Keep in mind that mechanical decapsulation will only remove material to within 10 to 15 microns of the circuitry. Chemical decapsulatio... ... middle of paper ... ...nnects. The newest version of the X-mill costs ≈90,000 usd well above the PetroThin. Both these mechanical systems wil have to utilize chemical decapsulation system to fully expose the circuit. Nisene Technology Group markets a chemical system called JetEtch and their newest system, the OmniEtch, which also delayers. There are also laser decapsulation systems which are very expensive but they are available. Control Systemation offers a unit called F/A Lit. At this time, I do not have any competitive pricing information on any of these systems. Our lab assisted in the development of this application and can also answer any questions. We have sold PetroThin’s for this application. The customers liked the ease of use and speed in which they can decapsulate multiple packages. For additional technical information, please contact us at info@buehler.com.

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