Sn-Pb Solders Essay

708 Words2 Pages

Solder alloys have been widely used as the interconnecting material in electronic packaging and assemblies because they provide both electrical interconnection as well as mechanical support.Sn-Pb solders were first used about 2000 years ago for metal interconnections.Pb containing solders especially the eutectic or near eutectic Sn-Pb alloys has long been the predominant choice of the electronics industry due to its low melting temperature (around 183oC),better wetting behavior and mechanical properties. Despite of all these advantages the toxicity of heavy metallic element Pb has lead in recent decades to increasing efforts to restrict its use. Following the banning of Pb in paints, fuels and plumbing application throughout the majority of the world, otherwise it could be demonstrated to present a direct risk to human health and environment.
Science and engineering of soldering has taken a major change in direction ever since the legislation that mandates restriction of certain hazardous substances (RoHS) and the waste electrical and electronic equipment had been introduced by many countries. The first administrative region of the world to actively legislate against Pb use in electronics has been the European Union, which has introduced RoHS and WEEE directives. These directives target the electrical and electronic equipment and are designed respectively to outlaw many harmful substances from use and make the producers of electrical and electronic goods responsible for their safe disposal or recycling at the end of their lives.
As cited by Environmental Protection Agency (EPA) of US, Pb and Pb containing compounds is one of the top 17 chemicals causing greatest threat to human life and environment.1st July 2006 has been official...

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...o its poor wettability, reliability, strength, easy oxidation and microvoid formation. In order to overcome these drawbacks and to further enhance the properties of Sn-Zn lead free system small amount of alloying elements such as Bi, Cu, In, Ag, Al, Ga, Sb, Cr, Ni, Ge were added as suggested by many researchers.
It has been found that the addition of Bi to the eutectic composition of Sn-Zn lead free system has improved various soldering properties. Addition of Bi decreases the melting point of the system and improves the wettability of Sn-Zn solder on Cu substrate. The wetting area increases by 2 -10 wt% approximately on addition of Bi content. On addition of Bi the surface tension of the solder has been decreased which has enhanced its wettability. Similarly the mechanical properties of the Sn-Zn solder have been improved on Bi addition but up to a certain extent.

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